Laird Tflex 300 Thermal Gap Filler

Laird Tflex 300 Thermal Gap Filler

Product Description

Laird Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of
compliancy allows the material to “totally blanket” the component, enhancing thermal transfer.
The material has a very low compression set enabling the pad to be reused many times. Laird Tflex 360, in achieving its stellar compliancy, does not sacrifice thermal performance. With a
thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures. Laird Tflex 300H is offered with a hard, metallized liner option for easy handling and improved
rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of parts
that must slide together, such as a card into a chassis.
Tflex 300TG is offered with a cut-through resistant Tgard silicone liner. The TG liner offers a
guaranteed dielectric barrier, and easier part handling for mass production.

FEATURES AND BENEFITS

• Extreme compliancy allows material to “totally blanket” components

• Thermal conductivity of 1.2 W/mK

• Low compression set enables the pad to be reused many times

• Environmentally friendly solution that meets regulatory requirements including RoHS and
REACH